गुणवत्ता Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing कारखाना
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गुणवत्ता Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing कारखाना
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Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing

ब्रांड नाम: LICHEN
मॉडल संख्या: नियंत्रण रेखा
उत्पत्ति का स्थान: चीन
प्रमाणीकरण: ISO
न्यूनतम आदेश मात्रा: 20 किग्रा
कीमत: Contact us
आपूर्ति करने की क्षमता: 3000एमटी/वर्ष

उत्पाद का विवरण


पवित्रता: ≥ 99.95% यथार्थ सामग्री: 5-30 wt%
कण आकार (D50): 30-120 एनएम पीएच रेंज: एडजस्टेबल
निष्कासन दर एकरूपता: उत्कृष्ट शेल्फ जीवन: 6-12 महीने
प्रमुखता देना

Ultra-low defect cerium oxide CMP slurry

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Cerium oxide slurry for semiconductor wafers

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Rare earth polishing slurry for silicon

उत्पाद का वर्णन


Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing

Product Overview

Our ultra-low defect cerium oxide CMP slurry is designed to meet the stringent requirements of next-generation semiconductor fabrication. The slurry delivers precise chemical-mechanical interaction between abrasive particles and silicon surfaces, enabling atomic-scale planarization required for advanced nodes and high-performance devices.

Engineered for compatibility with leading CMP platforms, the slurry supports stable processing across extended polishing cycles while maintaining consistent removal rates and excellent wafer yield performance.

Key Technical Advantages

  • Atomic-level surface finishing capability
  • Excellent defect control for advanced nodes
  • High process stability
  • Reduced scratch and haze formation
  • Optimized chemical reactivity
  • Semiconductor-grade purity control
  • Reliable large-scale manufacturing performance


Particle Size Distribution

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing 0

Applications

  • Advanced node semiconductor fabrication
  • STI and ILD planarization support
  • Silicon substrate finishing
  • CMP process development
  • Foundry and IDM manufacturing lines

उत्पाद हाइलाइट्स

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing Product Overview Our ultra-low defect cerium oxide CMP slurry is designed to meet the stringent requirements of next-generation semiconductor fabrication. The slurry delivers precise chemical-mechanical interactio...

संबंधित उत्पाद
गुणवत्ता Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing कारखाना

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing Product Overview Our ultra-low defect cerium oxide CMP slurry is designed to meet the stringent requirements of next-generation semiconductor fabrication. The slurry delivers precise chemical-mechanical interaction between abrasive particles and silicon surfaces, enabling atomic-scale planarization required for advanced nodes and high-performance devices. Engineered for compatibility with

गुणवत्ता Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization कारखाना

Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization

Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization Product Overview This advanced ceria-based CMP slurry is optimized for high-precision silicon wafer polishing where nanoscale surface control is required. The chemically active cerium oxide particles promote efficient material removal while preserving crystal integrity and minimizing subsurface damage. The slurry enables improved wafer flatness, reduced dishing and erosion effects,

गुणवत्ता High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing कारखाना

High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing

High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing Product Overview Our cerium oxide CMP polishing slurry is engineered for ultra-precision planarization of silicon wafers used in advanced semiconductor manufacturing. The slurry combines controlled mechanical abrasion with optimized chemical activity to achieve excellent surface flatness, low defectivity, and superior wafer surface integrity. Designed for modern CMP processes,

गुणवत्ता प्रतिस्पर्धी मूल्य दुर्लभ पृथ्वी सामग्री सेरियम कार्बोनेट सफेद पाउडर कारखाना

प्रतिस्पर्धी मूल्य दुर्लभ पृथ्वी सामग्री सेरियम कार्बोनेट सफेद पाउडर

Cerium Carbonate Molecular Formula: Ce₂(CO₃)₃ Appearance: Cerium carbonate is a white powder Application: Used in the manufacture of automobile exhaust purifiers, and also as an intermediate for producing metallic cerium, cerium oxide and other cerium compounds. Item Specification Testing Standard Item Ce 2 (CO 3 ) 3 -3N5B Ce 2 (CO 3 ) 3 -4NB Ce 2 (CO 3 ) 3 -4N5B Ce 2 (CO 3 ) 3 -5NB TREO(wt%) 45~50 45~50 45~50 45~50 Rare Earth Relative Purity (wt%) La 2 O 3 /TREO ≤0.01 ≤0.005

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आप 5 फ़ाइलों तक अपलोड कर सकते हैं और प्रत्येक फ़ाइल का आकार अधिकतम 10M है।