Kualitas Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing Pabrik
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Kualitas Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing Pabrik
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Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing

Nama merek: LICHEN
Nomor Model: LC
Tempat Asal: Cina
Sertifikasi: ISO
Jumlah pesanan minimum: 20KGS
Harga: Contact us
Kemampuan Penyediaan: 3000MT/tahun

Rincian produk


Kemurnian: ≥ 99,95% konten padat: 5-30% berat
Ukuran Partikel (D50): 30-120nm Kisaran Ph: dapat disesuaikan
Keseragaman Tingkat Penghapusan: Bagus sekali Umur Simpan: 6–12 bulan
Menyoroti

Ultra-low defect cerium oxide CMP slurry

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Cerium oxide slurry for semiconductor wafers

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Rare earth polishing slurry for silicon

Deskripsi Produk


Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing

Product Overview

Our ultra-low defect cerium oxide CMP slurry is designed to meet the stringent requirements of next-generation semiconductor fabrication. The slurry delivers precise chemical-mechanical interaction between abrasive particles and silicon surfaces, enabling atomic-scale planarization required for advanced nodes and high-performance devices.

Engineered for compatibility with leading CMP platforms, the slurry supports stable processing across extended polishing cycles while maintaining consistent removal rates and excellent wafer yield performance.

Key Technical Advantages

  • Atomic-level surface finishing capability
  • Excellent defect control for advanced nodes
  • High process stability
  • Reduced scratch and haze formation
  • Optimized chemical reactivity
  • Semiconductor-grade purity control
  • Reliable large-scale manufacturing performance


Particle Size Distribution

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing 0

Applications

  • Advanced node semiconductor fabrication
  • STI and ILD planarization support
  • Silicon substrate finishing
  • CMP process development
  • Foundry and IDM manufacturing lines

Sorotan Produk

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing Product Overview Our ultra-low defect cerium oxide CMP slurry is designed to meet the stringent requirements of next-generation semiconductor fabrication. The slurry delivers precise chemical-mechanical interactio...

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Kualitas Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing Pabrik

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing Product Overview Our ultra-low defect cerium oxide CMP slurry is designed to meet the stringent requirements of next-generation semiconductor fabrication. The slurry delivers precise chemical-mechanical interaction between abrasive particles and silicon surfaces, enabling atomic-scale planarization required for advanced nodes and high-performance devices. Engineered for compatibility with

Kualitas Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization Pabrik

Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization

Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization Product Overview This advanced ceria-based CMP slurry is optimized for high-precision silicon wafer polishing where nanoscale surface control is required. The chemically active cerium oxide particles promote efficient material removal while preserving crystal integrity and minimizing subsurface damage. The slurry enables improved wafer flatness, reduced dishing and erosion effects,

Kualitas High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing Pabrik

High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing

High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing Product Overview Our cerium oxide CMP polishing slurry is engineered for ultra-precision planarization of silicon wafers used in advanced semiconductor manufacturing. The slurry combines controlled mechanical abrasion with optimized chemical activity to achieve excellent surface flatness, low defectivity, and superior wafer surface integrity. Designed for modern CMP processes,

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Cerium Carbonate Molecular Formula: Ce₂(CO₃)₃ Appearance: Cerium carbonate is a white powder Application: Used in the manufacture of automobile exhaust purifiers, and also as an intermediate for producing metallic cerium, cerium oxide and other cerium compounds. Item Specification Testing Standard Item Ce 2 (CO 3 ) 3 -3N5B Ce 2 (CO 3 ) 3 -4NB Ce 2 (CO 3 ) 3 -4N5B Ce 2 (CO 3 ) 3 -5NB TREO(wt%) 45~50 45~50 45~50 45~50 Rare Earth Relative Purity (wt%) La 2 O 3 /TREO ≤0.01 ≤0.005

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