Kalite Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing Fabrika
<
Kalite Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing Fabrika
>

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing

Marka Adı: LICHEN
Model Numarası: LC
Menşe yeri: Çin
Sertifikasyon: ISO
Asgari sipariş miktarı: 20kg
Fiyat: Contact us
Tedarik Yeteneği: 3000MT/yıl

Ürün Ayrıntıları


Saflık: ≥ %99,95 katı içerik: ağırlıkça %5-30
Parçacık Boyutu (D50): 30-120nm Menşe Yeri: ayarlanabilir
Kaldırma Oranı Tekdüzeliği: Harika Raf ömrü: 6-12 ay
Vurgulamak

Ultra-low defect cerium oxide CMP slurry

,

Cerium oxide slurry for semiconductor wafers

,

Rare earth polishing slurry for silicon

Ürün Tanımı


Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing

Product Overview

Our ultra-low defect cerium oxide CMP slurry is designed to meet the stringent requirements of next-generation semiconductor fabrication. The slurry delivers precise chemical-mechanical interaction between abrasive particles and silicon surfaces, enabling atomic-scale planarization required for advanced nodes and high-performance devices.

Engineered for compatibility with leading CMP platforms, the slurry supports stable processing across extended polishing cycles while maintaining consistent removal rates and excellent wafer yield performance.

Key Technical Advantages

  • Atomic-level surface finishing capability
  • Excellent defect control for advanced nodes
  • High process stability
  • Reduced scratch and haze formation
  • Optimized chemical reactivity
  • Semiconductor-grade purity control
  • Reliable large-scale manufacturing performance


Particle Size Distribution

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing 0

Applications

  • Advanced node semiconductor fabrication
  • STI and ILD planarization support
  • Silicon substrate finishing
  • CMP process development
  • Foundry and IDM manufacturing lines

Ürün Özellikleri

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing Product Overview Our ultra-low defect cerium oxide CMP slurry is designed to meet the stringent requirements of next-generation semiconductor fabrication. The slurry delivers precise chemical-mechanical interactio...

İlişkili Ürünler
Kalite Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing Fabrika

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing

Ultra-Low Defect Cerium Oxide CMP Slurry For Semiconductor Silicon Wafer Manufacturing Product Overview Our ultra-low defect cerium oxide CMP slurry is designed to meet the stringent requirements of next-generation semiconductor fabrication. The slurry delivers precise chemical-mechanical interaction between abrasive particles and silicon surfaces, enabling atomic-scale planarization required for advanced nodes and high-performance devices. Engineered for compatibility with

Kalite Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization Fabrika

Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization

Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization Product Overview This advanced ceria-based CMP slurry is optimized for high-precision silicon wafer polishing where nanoscale surface control is required. The chemically active cerium oxide particles promote efficient material removal while preserving crystal integrity and minimizing subsurface damage. The slurry enables improved wafer flatness, reduced dishing and erosion effects,

Kalite High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing Fabrika

High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing

High-Purity Cerium Oxide CMP Slurry For Silicon Wafer Planarization & Semiconductor Manufacturing Product Overview Our cerium oxide CMP polishing slurry is engineered for ultra-precision planarization of silicon wafers used in advanced semiconductor manufacturing. The slurry combines controlled mechanical abrasion with optimized chemical activity to achieve excellent surface flatness, low defectivity, and superior wafer surface integrity. Designed for modern CMP processes,

Kalite Rekabetçi Fiyat Nadir Toprak Malzemesi Seryum Karbonat Beyaz Toz Fabrika

Rekabetçi Fiyat Nadir Toprak Malzemesi Seryum Karbonat Beyaz Toz

Cerium Carbonate Molecular Formula: Ce₂(CO₃)₃ Appearance: Cerium carbonate is a white powder Application: Used in the manufacture of automobile exhaust purifiers, and also as an intermediate for producing metallic cerium, cerium oxide and other cerium compounds. Item Specification Testing Standard Item Ce 2 (CO 3 ) 3 -3N5B Ce 2 (CO 3 ) 3 -4NB Ce 2 (CO 3 ) 3 -4N5B Ce 2 (CO 3 ) 3 -5NB TREO(wt%) 45~50 45~50 45~50 45~50 Rare Earth Relative Purity (wt%) La 2 O 3 /TREO ≤0.01 ≤0.005

Teklif Et

Herhangi bir sorunuz varsa lütfen aşağıdaki çevrimiçi talep iletişim formumuzu kullanın, ekibimiz en kısa sürede size geri dönüş yapacaktır.

En fazla 5 dosya yükleyebilirsiniz ve Her dosya boyutu en fazla 10 MB olabilir.