Quality Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization factory
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Quality Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization factory
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Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization

Brand Name: LICHEN
Model Number: LC
Place of Origin: CHINA
Certification: ISO
Minimum Order Quantity: 20KGS
Price: Contact us
Supply Ability: 3000MT/YEAR

Product Details


Purity: ≥ 99.95% Solid Content: 5-30 Wt%
Particle Size (D50): 80 Nm PH Range: Customizable
Defect Density: Ultra-Low Dispersion Stability: Excellent
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Ceria CMP slurry for silicon wafers

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Semiconductor planarization polishing slurry

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Rare earth CMP slurry with warranty

Product Description


Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization

Product Overview

This advanced ceria-based CMP slurry is optimized for high-precision silicon wafer polishing where nanoscale surface control is required. The chemically active cerium oxide particles promote efficient material removal while preserving crystal integrity and minimizing subsurface damage.

The slurry enables improved wafer flatness, reduced dishing and erosion effects, and enhanced process stability across large wafer diameters.

Key Technical Advantages

  • High wafer flatness control
  • Low dishing and erosion
  • Nanometer-level surface roughness
  • Excellent within-wafer uniformity
  • Low particle agglomeration
  • Easy post-CMP cleaning
  • Suitable for high-volume manufacturing


Particle Size Distribution

Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization 0

Applications

  • Silicon wafer final polishing
  • Logic and memory wafer CMP
  • Advanced packaging substrates
  • 300 mm wafer manufacturing
  • Surface defect reduction processes

Product Highlights

Advanced Ceria CMP Slurry For Silicon Wafer Polishing And Semiconductor Surface Planarization Product Overview This advanced ceria-based CMP slurry is optimized for high-precision silicon wafer polishing where nanoscale surface control is required. The chemically active cerium oxide particles ...

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